TopSec ID Module B.2
for Sensor Fytech CFS190-HKB
The TopSec B.2 module combines its advantages with advantages of the optical sensor unit from Fytech.
The optical sensor unit CFS190-HKB from Fytech provides high resolution, high contrast and small distortion.
The mechanical shell is made of ABS plastics material and the working surface and the prism is made of LAK glass material. So the CFS190-HKB possessed better properties of toughness, strength, anti-aging, resistance to sunlight, anti corrosion, etc. Because of its small size compared to other optical sensors it can widely be integrated and used in access control, banking, customs and other applications where optical technology is required. In combination with TopSec ID Module and its confirmed excellent image triggering and recognition features a powerful fingerprint recognition subsystem is fit together for usage for a wide range of user population and finger conditions. Through the integrated diagnostic and firmware update functions important features are available to install a professional service and maintenance workflow.
The TopSec ID Module B.2 for Sensor Testech TBS220
TopSec B.2 ID Module connects to the optical area Testtech TBS220 sensor technology. The sensor board with combination of Light Emitting Sensor and CMOS technology comparably performs high security level, durability, reliability and good image capturing capability. It also provides best condition for various applications with its relatively small size compared to other optical sensors. The robust and simple designed sensor unit with the Bio-I´s core technology "LE Sensor" only identifies a live human finger. The concave shape of sensor surface enhances the performance of fingerprint image capture. Together with TopSec integrated feedback and triggering functionality enhanced image quality ensures best recognition rates for wet and dry fingers. Sensor test functions help to maintain service and support of supplied applications. Latency effects caused by specific sensor surfaces are compensated and reduced through sensor specific latency checking algorithms.